In order to capitalize on the next generation architecture required by new telecom applications, Kaiam has focused on building a core competency in wafer-scalable, planar integrated optics using optical waveguides to build planar light circuits (PLCs) for these next generation applications. The technology base includes:

 

  • Materials Engineering: Stable long lifetime, low loss polymers, silica, lithium niobate, adhesives
  • Micro-Fabrication: Wet and dry etching; metallization; stepper photolithography
  • Manufacturing: Process and automation engineering; yield improvements
  • Product Engineering: Design innovations; integration; electronics; packaging; reliability

 

Kaiam addresses the entire production cycle of planar optical components from initial optical circuit design and customization to chip production, packaging and testing. The company has also developed proprietary processing methods and device designs that enable large-area integration of many waveguide and optical control devices. This advanced family of PhotonIC™ (pronounced Photon-I-C) components utilizes a large library of complex design modules that can be used to reduce the time and costs associated with new product development and rapidly provide customized products to meet customer demand for high-performance optical networks. Examples of Kaiam's products include wavelength multiplexing waveguide chips that combine as many as 80 wavelengths into a single optical transmission fiber while controlling the power level of light on each wavelength.

 

Para mais informações, acesse: Kaiam


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